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Superior Diamond
Properties for
Thermal Management

M10 and M11 single crystal diamonds deliver industry-leading thermal conductivity and precision engineering for high-performance devices and lasers.

Technical Overview

M10 and M11 are designed for advanced semiconductor and photonic applications where conventional materials reach their limits. Each product pairs exceptional thermal conductivity with tight geometric tolerances and precision surface finishing to ensure reliable system integration.

Property
M10
M11
Thermal Conductivity (κXY / κZ)
>2200 W/m·K
>2200 W/m·K
Crystal Type
single crystal diamond
Single-crystal diamond
Orientation
<100>, no non-diamond carbon
<111>, no non-diamond carbon
Surface Roughness (Ra & Sa)
~2–3nm
10–15nm depending on size
Geometric Tolerances
±50µm L/W, ±30µm thickness
±50µm L/W, ±30µm thickness
Chipouts
<200µm
<100µm
Metallization
Optional Ti/Pt/Au
Optional Ti/Pt/Au
Applications
CPUs, GPUs, laser diodes, power amplifiers, AI accelerators
Special applications

Built with Precision, Ready for Deployment

M10 and M11 are engineered through microwave plasma CVD growth, followed by laser cutting and chemo-mechanical polishing to nanometer or sub-nanometer precision.

01Integration & Deployment Highlights

Integration & Deployment Highlights

• Designed for integration into existing optoelectronic packages and attachment to heat sinks.

• Metallization layer thickness is tailored to the application:

    - 0.5–1 µm for CPU/GPU chips

    - 3–5 µm for laser diodes

• Soldered attachment via standard Au/Sn preforms for reliable thermal and electrical contact.

• Supports large-scale semiconductor assembly.

02APPLICATIONS

Applications

• CPUs, GPUs, and AI accelerators
• Power amplifiers and laser diodes
• Advanced manufacturing and optical devices

Unlock Maximum
Performance with
M10 & M11

Discover why our single crystal diamonds can prevent hotspots, improve thermal efficiency, and extend the lifespan of your most critical chips, lasers, and high-performance electronics.