Advanced Diamond Materials for Heat Management

M10 and M11 single-crystal diamonds deliver industry-leading thermal conductivity and precision engineering for high-performance chips and lasers.

How Northern Carbon Improves Heat Management

M10 and M11 are engineered to extract and dissipate heat from the most demanding electronic devices. By rapidly spreading heat isotropically, M10 and M11 minimize hotspots, enhance reliability, and enable higher sustained performance.

Why it Matters

Heat Limits Performance

Chips typically waste 45–65% of their power as heat, and localized hotspots can significantly degrade performance and efficiency.

Diamond Spreads Heat Faster

M10 and M11 plates transfer heat 5X faster than copper, spreading heat laterally to prevent hotspots.

Cooler Chips Last Longer

Reducing junction temperature by 10°C can double a chip’s lifespan.

Technical Overview

M10 and M11 are designed for advanced semiconductor and photonic applications where conventional materials reach their limits. Each product pairs exceptional thermal conductivity with tight geometric tolerances and precision surface finishing to ensure reliable system integration.

Property
M10
M11
Thermal Conductivity (κXY / κZ)
>2200 W/m·K
>2200 W/m·K
Crystal Type
Single-crystal diamond
Single-crystal diamond
Orientation
<100>, no non-diamond carbon
<111>, no non-diamond carbon
Surface Roughness (Ra & Sa)
~2–3nm
10–15nm depending on size
Geometric Tolerances
±50µm L/W, ±30µm thickness
±50µm L/W, ±30µm thickness
Chipouts
<200µm
<100µm
Metallization
Optional Ti/Pt/Au
Optional Ti/Pt/Au
Applications
CPUs, GPUs, laser diodes, power amplifiers, AI accelerators
Special applications

Unlock Maximum Performance with M10 & M11

Discover how our single-crystal diamonds can prevent hotspots, improve thermal efficiency, and extend the lifespan of your most critical chips, lasers, and high-performance electronics.