Diamonds Engineered to Keep Electronics Cool
M10 and M11 single-crystal diamonds spread heat faster than copper, letting CPUs, GPUs, laser diodes, and AI accelerators run cooler, faster, and more reliably.
Why Heat Management Matters
Even the most advanced chips dissipate 45–65% of their power as heat. When that heat concentrates into hotspots, it degrades performance, reduces reliability, and constrains design innovation. Northern Carbon diamond materials address this challenge by transferring heat away from critical regions up to 5X better than copper, enabling sustained peak performance and greater system efficiency.
Benefits at a Glance
• Prevent hotspots for stable performance
• Reduce chip junction temperature to extend lifespan
• Maintain reliability in high-power and AI applications
M10 & M11
M10 and M11 are Northern Carbon’s engineered single-crystal diamond solutions for advanced thermal management. M10 is tailored for CPUs, GPUs, and laser diodes, delivering rapid lateral heat spreading and ultra-precise, polished contact surfaces. M11 targets higher-power and more specialized applications, including AI accelerators, power amplifiers, and advanced optical systems—where maximum thermal performance and integration flexibility are essential.
M10
• Ideal for CPUs, GPUs, and laser diodes
• Rapid lateral heat spreading to prevent hotspots
• Precision-polished surfaces for reliable thermal contact
• Optional metallization for soldered integration
M11
• Designed for AI accelerators, power amplifiers, and next-gen electronics
• Thermal conductivity >2200 W/m·K (exceptional in-plane and vertical heat transfer)
• Nanometer-precision surface finish for maximum efficiency
• Flexible integration with high-current devices and complex assemblies
From Diamond Growth to Device Integration
Northern Carbon products are developed through a tightly controlled process that spans crystal growth, precision cutting, polishing, metallization, and final integration support. This ensures each plate is ready for demanding semiconductor and photonic environments.
Engineered from the Ground Up
Microwave-plasma CVD growth produces pure single-crystal diamond, which is then laser-cut and polished to nanometer or sub-nanometer precision.
Integrated for Maximum Performance
Special multi-layer (Au/Pt/Ti) metallization suitable forAu/Sn or In solder bonding, ensuring optimal heat transfer and electrical performance. Thickness is customized:
• 1µm for CPUs/GPUs
• 3–5µm for laser diodes
Ready for Real-World Applications
Deploy in CPUs, GPUs, AI accelerators, laser diodes, power amplifiers, and advanced manufacturing equipment by:
a) brazing or soldering the metallized heat spreader
or
b) direct bonding to the atomic level smooth surface of the unmetallized heat spreader
Integrate M10 & M11 Into Your High-Performance Systems
Reduce hotspots, increase efficiency, and extend chip lifespan with Northern Carbon diamonds.
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