Diamonds Engineered to Keep Electronics Cool
M10 and M11 single crystal diamonds spread heat faster than copper, letting CPUs, GPUs, laser diodes, and AI accelerators run cooler, faster, and more reliably.
M10 and M11 heat spreaders are highly valued in RF and laser packaging for their transient response, not just their steady-state heat-flux performance. A thermal pulse redistributes across the die roughly ten times faster than it does in copper.
Why Heat Management Matters
The most advanced chips dissipate 45–65% of their power as wasted heat. When that heat concentrates into hotspots, it degrades performance, reduces reliability, and constrains design innovation.
Northern Carbon diamond materials address this challenge by transferring heat away from critical regions up to 10x faster than copper, enabling sustained peak performance, lifetime, and greater system efficiency.
Benefits at a Glance
• Prevent hotspots for stable performance
• Reduce chip junction temperature to extend lifespan
• Maintain reliability in high-power and AI applications
M10 & M11
M10 and M11 are Northern Carbon’s engineered single crystal diamond solutions for advanced applications. M10 is tailored for CPUs, GPUs, and laser diodes, delivering rapid lateral heat spreading and ultra-precise, polished contact surfaces. M11 targets higher-power and more specialized applications, including AI accelerators, power amplifiers, and advanced optical systems—where maximum thermal performance and integration flexibility are essential.
M10
• Ideal for CPUs, GPUs, and laser diodes
• Thermal conductivity > 2200 W/m·K
• Isotropic heat spreading to prevent hotspots
• Precision-polished surfaces for reliable thermal contact
• Optional metallization for soldered integration bonding
M11
• Designed for AI accelerators, power amplifiers, and next-gen electronics
• Thermal conductivity > 2200 W/m·K (exceptional in-plane and cross-plane heat transfer)
• Nanometer-precision surface finish
• Precision-finished surfaces for integration with high-current devices and complex assemblies
Manufacturing & Integration
Each M10 plate is precision engineered, metallized, and rigorously inspected to guarantee seamless integration into high-performance electronic systems.
Atomic-Level Precision
Custom Metallization
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Solder & Bonding Flexibility
METROLOGY & RIGOROUS QC
Tailored Integration
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From Diamond Growth
to Device Integration
Northern Carbon products are developed through a tightly controlled process that spans crystal growth, precision cutting, polishing, metallization, and final integration support. This ensures each plate is ready for demanding semiconductor and photonic environments.
01STEP 01
Engineered from high-purity reactive gases
Microwave plasma CVD growth produces pure single crystal diamond, which is then laser cut and polished to nanometer or sub-nanometer precision.
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02Step 02
Formed for Maximum Performance
Reducing the junction temperature by 10°C can double chip reliability and throughput.
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03STEP 03
Multilayered Metallization for Maximum Performance
Special multilayer (Au/Pt/Ti) metallization is suitable for Au/Sn or In solder bonding, ensuring optimal thermal contact and electrical performance. Metallization thickness is customized:
• 1 µm for CPUs/GPUs
• 3–5 µm for laser diodes
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04STEP 04
Ready for Real-World Applications
Deploy in CPUs, GPUs, AI accelerators, laser diodes, power amplifiers, and advanced manufacturing equipment by:
a) brazing or soldering the metallized heat spreader
or
b) direct bonding of the device to the atomic level smooth surface of the unmetallized CVD diamond heat spreader
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Integrate M10 & M11 Into Your High-Performance Systems
Reduce hotspots, increase efficiency, and extend chip lifespan with Northern Carbon diamonds.
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