M11: Next-Generation Diamond for Extreme Device Performance

M11 pushes the limits of heat management and precision integration, engineered for the highest-power AI accelerators, laser systems, and advanced optical devices.

Contact us today
Request Technical Consultation
Performance Benefits

Impact & Performance

M11 is designed for the most demanding wide bandgap device, for special thermal and optical applications, delivering consistent lateral heat transfer and ultra-stable performance under extreme conditions.

01Targeting Extreme Hotspots

M11 spreads concentrated heat as well as M10, maintaining efficiency and reliability in high-density, high-power systems for next generation devices.

02Maximize Device Reliability

Lowering junction temperature by 10–15°C extends lifespan and ensures sustained performance in mission-critical applications.

03Atomic-Level Control

Manufactured to sub-nanometer tolerances with optional metallization layers, M11 supports devices with unique current, RF, and photonic requirements.

Product Specifications

Technical Overview

M11 is built for the most demanding thermal and integration environments, combining ultra-high conductivity with atomic-level surface control. It is suited for advanced devices where thermal stability, reliability, and specialized packaging requirements are essential.

Property
M11
Details
Thermal Conductivity κXY / κZ
>2100 W/m·K
Exceptional in-plane and through-plane thermal performance
Crystal Type
Single-crystal diamond
<111> orientation, no non-diamond carbon
Surface Roughness (Ra & Sa)
Polished ~ 0.5-3nm
Lapped ~ 150-250nm
Varies by plate size
Geometric Tolerances
±30µm L/W, ±20µm thickness
Parallelism within 0.5°
Chipouts
<100µm
Ensures consistent contact
Metallization
Optional
Supports thermal, electrical, and RF applications
Applications
Current and future extreme devices
High-performance, high-density electronics
How It Works

Manufacturing & Integration

M11 combines advanced growth, precision engineering, and tailored integration to support cutting-edge applications.

Atomic-Level Precision

Plates are grown via advanced microwave-plasma CVD, laser-cut, and chemo-mechanically polished to sub-nanometer tolerances, supporting the most thermally and optically sensitive devices.

Custom Metallization

Optional Ti/Pt/Au layers can be customized for specialized current-carrying, RF, or photonic requirements, ensuring device-specific performance.

Solder & Bonding Flexibility

M11 supports both standard Au/Sn preforms and high-current soldering, allowing reliable integration into photonic, power, and laser systems.

Rigorous QA & Metrology

Each M11 plate is fully scanned with proprietary automated metrology, confirming nanometer-level flatness, consistent thermal performance, and zero inclusions. Third-party verification adds an additional layer of confidence.

Tailored Integration

M11 is designed for direct deployment in high-density, high-performance packages, including AI accelerators, high-power lasers, and advanced optical devices, reducing integration time and ensuring immediate performance benefits.

Integrate M11 Into Your Advanced Systems

M11 enables next-level thermal and optical management for high-power and high-density devices. Deploy M11 to maximize reliability, efficiency, and lifespan in the most demanding electronic and photonic systems.

Request Technical Consultation